Samsung ElectronicsKMQE60013M-B318Multi-Chip Package Memory
Multi-Chip Package Memory (MCP)
| Supplier Unconfirmed | |
| Obsolete | |
| Automotive | No |
| PPAP | No |
| Befestigung | Surface Mount |
| Leiterplatte geändert | 221 |
| Lieferantenverpackung | FBGA |
| 221 |
| EDA / CAD Models |
Multi-Chip Package Memory (MCP)
| Supplier Unconfirmed | |
| Obsolete | |
| Automotive | No |
| PPAP | No |
| Befestigung | Surface Mount |
| Leiterplatte geändert | 221 |
| Lieferantenverpackung | FBGA |
| 221 |
| EDA / CAD Models |