Samsung Electronics Multi-Chip Package Memory
Teile-Nr. | Preis | Bestand | Hersteller | Kategorie | Pin Count | Supplier Package | Standard Package Name | Military | AEC Qualified | Auto motive | P PAP | SVHC Exceeds Threshold |
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KMGD6001BM-B421 Combining Mobile DRAM and NAND |
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Samsung Electronics | Multi-Chip Package Memory | No | ||||||||
KMQX10013M-B419
eMMC 32GB and LPDDR3 16Gb with 1600Mbps
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Samsung Electronics | Multi-Chip Package Memory | 221 | FBGA | No | No | |||||
KM8V7001JA-B813 LPDDR5 MCP Memory |
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Samsung Electronics | Multi-Chip Package Memory | FBGA | ||||||||
KMFNX0012M-B214006
8GB eMMC + 8Gb LPDDR3 1866Mbps, 211FBGA
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Samsung Electronics | Multi-Chip Package Memory | 221 | FBGA | BGA | No | No | No | No | No | |
KMFN60012B-B214
IC FLASH 8GB EMMC, 8Gb LPDDR3
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Samsung Electronics | Multi-Chip Package Memory | 221 | FBGA | BGA | No | |||||
KMQE60013M-B318
Multi-Chip Package Memory (MCP)
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Samsung Electronics | Multi-Chip Package Memory | FBGA | No | No | No | No | No |