Demand for plug-in hybrid and all-electric vehicles (xEV) continues to rise. These vehicles are packed full of power electronics – most of which are currently based on silicon. However, the latest xEV designs call for advances in efficiency and power density.
Silicon carbide (SiC) is emerging as the material of choice to overcome the performance plateau of silicon. Highlights such as low switching losses, high temperature capability and high switching frequency, make it ideal to meet demanding xEV requirements. SiC based solutions promise to be more efficient, lighter, and compacter than conventional applications.
Watch Infineon introduce its large portfolio of IGBT automotive components in this video showing a main inverter demo implemented by SUNGROW, HybridPACK™ drive power modules, HybridPACK™ 1 DC6 wave, HybridPACK™ drive CoolSiC™, low-loss DuoPack IGBT in TRENCHSTOP™; and evaluation board for EiceDRIVER™ sense and EiceDRIVER™ Boost.
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