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Bei der Auswahl einer Kategorie werden Ihnen mehr Filtermöglichkeiten und Produktdetails zur Verfügung gestellt.
| Teile-Nr. | Preis | Bestand | Hersteller | Kategorie | Beschreibung | Maximum Current Rating - (A) | Insulation Resistance - (MOhm) | Impedance - (Ohm) | Speed Rating - (Gbps) | Maximum Contact Resistance - (mOhm) | Housing Material | Termination Method | Gender | Tradename | Mating Cycle - (Cycles) | Row Spacing - (mm) | Contact Material | Number of Contacts | Operating Temperature - (°C) | Terminal Pitch - (mm) | VITA Standard | Product Length - (mm) | Product Depth - (mm) | Number of Rows | Maximum Operating Temperature - (°C) | Minimum Operating Temperature - (°C) | ROHS | Product Height - (mm) | Mounting | Maximum Voltage Rating | Body Orientation | Life Cycle | Type | Contact Plating | Housing Color | Packaging |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Datenblatt für 14 Produkte: Anzeigen
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Datenblatt ansehen |
Verschiedenes
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Samtec | Steckverbinder, Mutterplatine | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | Verschiedenes | ||||||||
HDTF-6-08-S-RA-LC-100
PCB Backplane Connector
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Samtec | Steckverbinder, Mutterplatine | PCB Backplane Connector | ||||||||||||||||||||||||||||||||
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HDTF-6-06-S-RA-LC-100
PCB Backplane Connector
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Samtec | Steckverbinder, Mutterplatine | PCB Backplane Connector | ||||||||||||||||||||||||||||||||
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HDTF-3-04-S-RA-HS-100
Conn High Density Backplane RCP 24 POS 1.8mm Press Fit RA Thru-Hole XCede® Tray
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Samtec | Steckverbinder, Mutterplatine | Conn High Density Backplane RCP 24 POS 1.8mm Press Fit RA Thru-Hole XCede® Tray | ||||||||||||||||||||||||||||||||
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HDTF-4-08-S-RA-LC-100
Conn High Density Backplane RCP 64 POS 1.8mm Press Fit RA Thru-Hole XCede® Tray
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Samtec | Steckverbinder, Mutterplatine | Conn High Density Backplane RCP 64 POS 1.8mm Press Fit RA Thru-Hole XCede® Tray | 1000 | 100 | 10 | Liquid Crystal Polymer | Press Fit | RCP | XCede® | 250 | Copper Alloy | 64 | 1.8 | 14.4 | 29.4 | 13 | Yes | 16.4 | Through Hole | Right Angle | Active | High Density Backplane | Gold Over Nickel | Black | Tray | |||||||||
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HDTF-4-08-S-RA-HS-085
Conn High Density Backplane RCP 64 POS 1.8mm Press Fit RA Thru-Hole XCede® Tray
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Samtec | Steckverbinder, Mutterplatine | Conn High Density Backplane RCP 64 POS 1.8mm Press Fit RA Thru-Hole XCede® Tray | 1000 | 85 | 10 | Liquid Crystal Polymer | Press Fit | RCP | XCede® | 250 | Copper Alloy | 64 | 1.8 | 14.4 | 29.4 | 13 | Yes | 16.8 | Through Hole | Right Angle | Active | High Density Backplane | Gold Over Nickel | Tray | ||||||||||
HPTS-6-S-D-VT
Conn Backplane Power RCP 8 POS 3.2mm Press Fit ST Thru-Hole XCede® Tray
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Samtec | Steckverbinder, Mutterplatine | Conn Backplane Power RCP 8 POS 3.2mm Press Fit ST Thru-Hole XCede® Tray | Liquid Crystal Polymer | Press Fit | RCP | XCede® | Copper Alloy | 8 | 3.2 | 18.99 | 5.6 | 2 | Yes | 10.13 | Through Hole | Straight | Active | Backplane Power | Gold Over Nickel | Black | Tray | |||||||||||||
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HPTS-3-S-D-VT
Conn Backplane Power RCP 4 POS 3.2mm Press Fit ST Thru-Hole XCede® Tray
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Samtec | Steckverbinder, Mutterplatine | Conn Backplane Power RCP 4 POS 3.2mm Press Fit ST Thru-Hole XCede® Tray | Liquid Crystal Polymer | Press Fit | RCP | XCede® | Copper Alloy | 4 | 3.2 | 9.73 | 5.6 | 2 | Yes | 10.13 | Through Hole | Straight | Active | Backplane Power | Gold Over Nickel | Black | Tray | |||||||||||||
HDTF-3-08-S-RA-HS-100
1.80 mm High-Density Backplane Right-Angle Receptacle
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Samtec | Steckverbinder, Mutterplatine | 1.80 mm High-Density Backplane Right-Angle Receptacle | Yes | Active | Tray | |||||||||||||||||||||||||||||
HDTF-4-08-S-RA-HS-100
Conn High Density Backplane RCP 64 POS 1.8mm Press Fit RA Thru-Hole XCede® Tray
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Samtec | Steckverbinder, Mutterplatine | Conn High Density Backplane RCP 64 POS 1.8mm Press Fit RA Thru-Hole XCede® Tray | 1000 | 100 | 10 | Liquid Crystal Polymer | Press Fit | RCP | XCede® | 250 | Copper Alloy | 64 | 1.8 | 14.4 | 29.4 | 13 | Yes | 16.8 | Through Hole | Right Angle | Active | High Density Backplane | Gold Over Nickel | Tray | ||||||||||
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HDTF-3-06-S-RA-LC-100
1.80 mm High-Density Backplane Right-Angle Receptacle
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Samtec | Steckverbinder, Mutterplatine | 1.80 mm High-Density Backplane Right-Angle Receptacle | Yes | Active | Tray | |||||||||||||||||||||||||||||
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HDTF-4-06-S-RA-LC-100
1.80 mm High-Density Backplane Right-Angle Receptacle
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Samtec | Steckverbinder, Mutterplatine | 1.80 mm High-Density Backplane Right-Angle Receptacle | ||||||||||||||||||||||||||||||||
HDTF-6-08-S-RA-HS-100
HD 1.80 mm High-Density Backplane Right-Angle Receptacle
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Samtec | Steckverbinder, Mutterplatine | HD 1.80 mm High-Density Backplane Right-Angle Receptacle | Yes | Active | Bulk | |||||||||||||||||||||||||||||
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HDTF-4-06-S-RA-HS-100
High-Density Backplane Right-Angle Receptacle
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Samtec | Steckverbinder, Mutterplatine | High-Density Backplane Right-Angle Receptacle | ||||||||||||||||||||||||||||||||
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HPTS-4-S-D-VT
Conn Backplane Power RCP 6 POS 3.2mm Press Fit ST Thru-Hole XCede® Tray
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Samtec | Steckverbinder, Mutterplatine | Conn Backplane Power RCP 6 POS 3.2mm Press Fit ST Thru-Hole XCede® Tray | Liquid Crystal Polymer | Press Fit | RCP | XCede® | Copper Alloy | 6 | 3.2 | 14.36 | 5.6 | 2 | Yes | 10.13 | Through Hole | Straight | Active | Backplane Power | Gold Over Nickel | Black | Tray |