Samsung Electronics Flash
| Teile-Nr. | Preis | Bestand | Hersteller | Kategorie | Cell Type | Density - (bit) | Architecture | Boot Block | Block Organization | Address Width - (bit) | Number of Bits per Word - (bit) | Number of Words | Programmability | Timing Type | Maximum Access Time - (ns) | Process Technology | Interface Type | Minimum Operating Supply Voltage - (V) | Maximum Operating Supply Voltage - (V) | Maximum Operating Current - (mA) | Density in Bits - (bit) | Pin Count | Supplier Package | Standard Package Name | CECC Qualified | ESD Protection | Military | AEC Qualified | AEC Qualified Number | Auto motive | P PAP | ECCN Code | SVHC | SVHC Exceeds Threshold |
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KLM8G1GESD-B04Q
8GB eMMC of 153FBGA
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Samsung Electronics | Flash | 153 | FBGA | BGA | No | No | No | No | 3A991.b.1.a | No | ||||||||||||||||||||||
| K9F1G08U0F-SIB0000 Industrial NAND Flash |
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Samsung Electronics | Flash | No | No | No | No | No | ||||||||||||||||||||||||||
| K9F1208U0A-YCB0000 SLC NAND Flash Parallel 3.3V 512M-bit 64M x 8 12us 48-Pin TSOP-I Tray |
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Samsung Electronics | Flash | 48 | TSOP-I | SO | No | No | No | No | No | 3A991.b.1.a | No | |||||||||||||||||||||
KLM8G1GESD-B03P017
eMMC 5.0 Flash 8GB 1.8 / 3.3 V
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Samsung Electronics | Flash | No | No | No | No | No | ||||||||||||||||||||||||||
| K9F4G08U0B-PCB0T00 SLC NAND Flash 3.3V 4G-bit 512M x 8 48-Pin TSOP-I |
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Samsung Electronics | Flash | 48 | TSOP-I | SOP | No | No | No | 3A991.b.1.a | No | |||||||||||||||||||||||
KLM8G1GEME-B0410
Flash Serial e-MMC 1.8V/3.3V 64G-bit 153-Pin FBGA
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Samsung Electronics | Flash | 153 | FBGA | BGA | No | No | No | No | 3A991.b.1.a | No | ||||||||||||||||||||||
| KLMCG8WEBC-B031 Managed NAND Flash Memory |
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Samsung Electronics | Flash | No | No | No | No | No | ||||||||||||||||||||||||||
| K9F2G08U0D-SCB0000 2Gb D-die NAND Flash |
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Samsung Electronics | Flash | No | No | |||||||||||||||||||||||||||||
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KLMAG1JENB-B041
MLC NAND Flash Serial e-MMC 128G-bit
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Samsung Electronics | Flash | No | No | No | No | No | 3A991.b.1.a | No |