Miniaturization for smart IoT devices
Gain insights into overcoming miniaturization challenges associated with antenna design and PCB connectors and components.
There are unique challenges with integrating multiple wireless technologies into smart IoT devices, including the need to be waterproof and withstand high temperatures, shock and vibration. Rugged and robust designs, miniaturization, long battery life and high performance are all critical factors that allow these devices to deliver reliable, seamless connectivity.
Discover TE’s design considerations for overcoming these challenges in this informative white paper and
on-demand webinar.
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Analog Devices' webinar: Edge to Cloud, Connect & Control with Remote IO modules
This Analog Devices webinar will explain how such modules can be leveraged in the automation system and implemented today to provide more flexibility, edge node insights and connectivity to fit into an edge-to-cloud based AI-driven system.