Samsung Electro-Mechanics Keramikkondensatoren
| Teile-Nr. | Preis | Bestand | Hersteller | Kategorie | Capacitance Value | Tolerance | Voltage | Dielectric | Technology | Special Features | Construction | Termination Style | Terminal Pitch - (mm) | Case Style | Package/Case | Operating Temperature - (°C) | Size - (mm) | Packaging | Maximum Dissipation Factor - (%) | Equivalent Series Resistance Type | Rad Hard | CECC Qualified | ESD Protection | Military | AEC Qualified | AEC Qualified Number | Auto motive | P PAP | ECCN Code | SVHC | SVHC Exceeds Threshold |
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CL10C100JC8NNWC
Cap Ceramic 10pF 100V C0G 5% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 10pF | 5% | 100VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | No | No | No | No | NLR | No | No | |||||||||
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Meist Gekauft
CL10B103KB8NNNC
Cap Ceramic 0.01uF 50V X7R 10% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.01uF | 10% | 50VDC | X7R | Standard | Highly Reliable Performance|Highly Reliable Tolerance and High Speed Automatic Chip Placement on PCBs|Wide Capacitance Range | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | 2.5 | Low | Yes | No | No | No | No | EAR99 | No | No | |||||
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CL10B153KB85PNC
Cap Ceramic 0.015uF 50V X7R 10% Pad SMD 0603 OMD-CAP 125°C T/R Automotive AEC-Q200
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.015uF | 10% | 50VDC | X7R | Open Mode | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | No | Yes | AEC-Q200 | Yes | Unknown | EAR99 | No | No | ||||||||
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CL21A475KQCLNNC
Cap Ceramic 4.7uF 6.3V X5R 10% Pad SMD 0805 85°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 4.7uF | 10% | 6.3VDC | X5R | Standard | Flat | Pad | N/R | Ceramic Chip | 0805 | 2 X 1.25 X 0.85 | Tape and Reel | 10 | No | No | No | No | EAR99 | No | No | ||||||||
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CL21B223KB6WPNC
Cap Ceramic 0.022uF 50V X7R 10% Pad SMD 0805 OMD-CAP 125°C T/R Automotive AEC-Q200
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.022uF | 10% | 50VDC | X7R | Open Mode | Flat | Pad | N/R | Ceramic Chip | 0805 | 2 X 1.25 X 0.6 | Tape and Reel | 3 | No | Yes | AEC-Q200 | Yes | Unknown | EAR99 | No | No | |||||||
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CL21B472KCANNND
Cap Ceramic 0.0047uF 100V X7R 10% Pad SMD 0805 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.0047uF | 10% | 100VDC | X7R | Standard | Flat | Pad | N/R | Ceramic Chip | 0805 | 2 X 1.25 X 0.65 | Tape and Reel | No | No | No | No | EAR99 | No | No | |||||||||
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Meist Gekauft
CL21B104KCC5PNC
Cap Ceramic 0.1uF 100V X7R 10% Pad SMD 0805 OMD-CAP 125°C T/R Automotive AEC-Q200
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.1uF | 10% | 100VDC | X7R | Open Mode | Flat | Pad | N/R | Ceramic Chip | 0805 | 2 X 1.25 X 0.85 | Tape and Reel | 2.5 | Low | No | Yes | AEC-Q200 | Yes | Unknown | EAR99 | No | No | ||||||
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CL21C120JBANNNC
Cap Ceramic 12pF 50V C0G 5% Pad SMD 0805 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 12pF | 5% | 50VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 0805 | 2 X 1.25 X 0.65 | Tape and Reel | No | No | No | No | EAR99 | No | No | |||||||||
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CL31A226MOHNNNE
Cap Ceramic 22uF 16V X5R 20% Pad SMD 1206 85°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 22uF | 20% | 16VDC | X5R | Standard | Flat | Pad | N/R | Ceramic Chip | 1206 | 3.2 X 1.6 X 1.6 | Tape and Reel | 10 | Yes | No | No | No | No | EAR99 | No | No | |||||||
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CL31B226KPHNNNE
Cap Ceramic 22uF 10V X7R 10% Pad SMD 1206 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 22uF | 10% | 10VDC | X7R | Standard | High Dielectric Constant | Flat | Pad | N/R | Ceramic Chip | 1206 | 3.2 X 1.6 X 1.6 | Tape and Reel | 10 | Low | Yes | No | No | No | No | EAR99 | No | No | |||||
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CL05C220JB5NNND
Cap Ceramic 22pF 50V C0G 5% Pad SMD 0402 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 22pF | 5% | 50VDC | C0G | Standard | Highly Reliable Performance|Highly Reliable Tolerance and High Speed Automatic Chip Placement on PCBs|Wide Capacitance Range | Flat | Pad | N/R | Ceramic Chip | 0402 | 1 X 0.5 X 0.5 | Tape and Reel | No | No | No | No | EAR99 | No | No | ||||||||
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CL05C2R4CB5NNNC
Cap Ceramic 2.4pF 50V C0G 0.25pF Pad SMD 0402 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 2.4pF | 0.25pF | 50VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 0402 | 1 X 0.5 X 0.5 | Tape and Reel | No | No | No | No | EAR99 | No | No | |||||||||
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CL05C8R2BB5NNNC
Cap Ceramic 8.2pF 50V C0G 0.1pF Pad SMD 0402 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 8.2pF | 0.1pF | 50VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 0402 | 1 X 0.5 X 0.5 | Tape and Reel | No | No | No | No | EAR99 | No | No | |||||||||
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CL05C820JA5NNNC
Cap Ceramic 82pF 25V C0G 5% Pad SMD 0402 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 82pF | 5% | 25VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 0402 | 1 X 0.5 X 0.5 | Tape and Reel | Unknown | No | No | No | No | EAR99 | No | No | ||||||||
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CL05F224ZP5NNNC
Cap Ceramic 0.22uF 10V Y5V -20% to 80% Pad SMD 0402 85°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.22uF | -20% to 80% | 10VDC | Y5V | Standard | Flat | Pad | N/R | Ceramic Chip | 0402 | 1 X 0.5 X 0.5 | Tape and Reel | 12.5 | No | No | No | No | EAR99 | No | |||||||||
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CL10A224KA8NNNC
Cap Ceramic 0.22uF 25V X5R 10% Pad SMD 0603 85°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.22uF | 10% | 25VDC | X5R | Standard | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | 3.5 | No | No | No | No | EAR99 | No | No | ||||||||
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Meist Gesucht
CL10B104KB8NNND
Cap Ceramic 0.1uF 50V X7R 10% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.1uF | 10% | 50VDC | X7R | Standard | Highly Reliable Performance|Highly Reliable Tolerance and High Speed Automatic Chip Placement on PCBs|Wide Capacitance Range | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | 2.5 | Low | No | No | No | No | EAR99 | No | No | ||||||
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Meist Gekauft
CL10B104KO8NNNL
Cap Ceramic 0.1uF 16V X7R 10% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.1uF | 10% | 16VDC | X7R | Standard | High Dielectric Constant | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | 3.5 | No | No | No | No | EAR99 | No | No | |||||||
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CL10B104KO85PNC
Cap Ceramic 0.1uF 16V X7R 10% Pad SMD 0603 OMD-CAP 125°C T/R Automotive AEC-Q200
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.1uF | 10% | 16VDC | X7R | Open Mode | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | No | Yes | AEC-Q200 | Yes | Unknown | EAR99 | No | No | ||||||||
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CL10B222KB8NCNC
Cap Ceramic 0.0022uF 50V X7R 10% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.0022uF | 10% | 50VDC | X7R | Standard | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | 2.5 | No | No | No | No | EAR99 | No | No | ||||||||
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CL10B331JB8NNNC
Cap Ceramic 330pF 50V X7R 5% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 330pF | 5% | 50VDC | X7R | Standard | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | 2.5 | No | No | No | No | EAR99 | No | No | ||||||||
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CL10B471KB8NNNL
Cap Ceramic 470pF 50V X7R 10% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 470pF | 10% | 50VDC | X7R | Standard | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | 2.5 | No | No | No | No | EAR99 | No | No | ||||||||
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CL10B472KB85PNC
Cap Ceramic 0.0047uF 50V X7R 10% Pad SMD 0603 OMD-CAP 125°C T/R Automotive AEC-Q200
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.0047uF | 10% | 50VDC | X7R | Open Mode | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | No | Yes | AEC-Q200 | Yes | Unknown | EAR99 | No | No | ||||||||
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CL10C140JB8NNNC
Cap Ceramic 14pF 50V C0G 5% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 14pF | 5% | 50VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | No | No | No | No | EAR99 | No | No | |||||||||
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CL10C131JB8NNNC
Cap Ceramic 130pF 50V C0G 5% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 130pF | 5% | 50VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | No | No | No | No | EAR99 | No | No |