The Winbond SpiStack® W25M Memory Series stacks homogeneous or heterogeneous flash to store memory for various code and data storage densities. SpiStack architecture provides the full flexibility to tailor flash solutions to a design’s specific memory-density and application requirements.
The Winbond SpiStack® W25M Memory Series stacks homogeneous or heterogeneous flash to store memory for various code and data storage densities. SpiStack architecture provides the full flexibility to tailor flash solutions to a design’s specific memory-density and application requirements.
Make your high-density SPI designs simple, small, and cost-effective with Winbond’s SpiStack® W25M Memory Series. This innovative solution enables homogeneous or heterogeneous flash stacking of multiple devices with the SPI interface. Homogeneous stacking can stack two or more SPI NOR Flash or two or more serial NAND devices. Heterogeneous stacking achieves greater density in a small package by putting an SPI NOR Flash on top of a Serial NAND. This also achieves fewer pins and simple routing for a reduced board size. The Winbond SpiStack offers system scalability within a small space, easier PCB routing, and faster product development.
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